电阻缝焊制备核壳结构铁基非晶纳米晶涂层及温度场数值模拟
Journal: Building Development DOI: 10.12238/bd.v9i2.4380
Abstract
通过电阻缝焊技术,将90-60μm和20-30μm非晶粉末按6:4比例混合,成功在SUS304不锈钢表面制备了以非晶相为核(47.8%)、α-Fe纳米晶为壳的梯度涂层。TEM分析表明,核区为非晶,壳区为α-Fe纳米晶。涂层硬度达1340Hv,较单一非晶涂层提升100Hv。基于电-热耦合模型,揭示了温度场U型梯度分布(中心1250K左右)诱导非晶选择性晶化的机制：表层热累积触发晶化(晶化温度1150K左右)。模拟与实验温度误差<2%,证实模型可指导涂层结构调控。
Keywords
电阻缝焊(RSW)；非晶纳米晶涂层；数值模拟；电热耦合；核壳结构
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